schematic cleanup

pull/1/head
Clyne 7 months ago
parent 2535aace51
commit b4360fbf44
Signed by: clyne
GPG Key ID: 3267C8EBF3F9AFC7

2
.gitignore vendored

@ -3,4 +3,6 @@
*.pretty *.pretty
*.step *.step
build build
hardware/fp-info-cache
hardware/noisecard-backups
hardware/production hardware/production

@ -7416,7 +7416,7 @@
(gr_text "FABRICATION DRAWING" (at 150 25) (layer "Dwgs.User") (tstamp d68f8496-1f7a-4583-b409-3c765734f735) (gr_text "FABRICATION DRAWING" (at 150 25) (layer "Dwgs.User") (tstamp d68f8496-1f7a-4583-b409-3c765734f735)
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(gr_text "NOTES\n\n 1. PRINTED CIRCUIT BOARD MADE FROM NEMA GRADE FR-4 EPOXY LAMINATE.\n 2. ALL DIMENSIONS ARE GIVEN IN MILLIMETERS.\n 3. CIRCUIT PATHS ARE FOR REFERENCE ONLY.\n 4. HOLE SIZES SHOWN ARE FINISHED DIAMETERS AFTER PLATING.\n 5. APPLY GREEN SOLDER MASK ON PLATED SURFACES.\n 6. SILKSCREEN TOP SIDE USING WHITE INK.\n 7. ALL VIAS ARE TENTED ON BOTH SIDES.\n 8. 2 COPPER LAYERS.\n 9. 1.6MM BOARD THICKNESS.\n10. COPPER THICKNESS 1 OZ." (at 38.75 139) (layer "Dwgs.User") (tstamp d939a69e-194e-46a0-9c0c-335c0a91742c) (gr_text "NOTES\n\n 1. PRINTED CIRCUIT BOARD MADE FROM NEMA GRADE FR-4 EPOXY LAMINATE.\n 2. ALL DIMENSIONS ARE GIVEN IN MILLIMETERS.\n 3. CIRCUIT PATHS ARE FOR REFERENCE ONLY.\n 4. HOLE SIZES SHOWN ARE FINISHED DIAMETERS AFTER PLATING.\n 5. APPLY GREEN SOLDER MASK ON PLATED SURFACES.\n 6. SILKSCREEN TOP SIDE USING WHITE INK.\n 7. ALL VIAS ARE TENTED ON BOTH SIDES.\n 8. 2 COPPER LAYERS.\n 9. 0.8MM BOARD THICKNESS.\n10. COPPER THICKNESS 1 OZ." (at 38.75 139) (layer "Dwgs.User") (tstamp d939a69e-194e-46a0-9c0c-335c0a91742c)
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(gr_text "{\\H2.0000;www.hammondmfg.com}" (at 602.59387 247.297935) (layer "User.3") (tstamp 05fdb0fe-aa41-4d1c-9218-ed7330023c5e) (gr_text "{\\H2.0000;www.hammondmfg.com}" (at 602.59387 247.297935) (layer "User.3") (tstamp 05fdb0fe-aa41-4d1c-9218-ed7330023c5e)

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